The problem of variations induced by the chemical-mechanical polishing (CMP) step has been discussed for years in process ... chip performance, even if you do go back and re-close timing. Mentor’s ...

Before the bonding step, these wafers will pass through at least one CMP processing step, the associated post-CMP, pre-bond cleaning steps, and the bonding process ... the chip are very susceptible to ...

Introduction strengthens STMicroelectronics’ position as a semiconductor technology leader Used by universities, research labs and companies for next generation System-on-Chip ... rules and design ...