Abstract: With the end of Dennard scaling, three dimensional stacking has emerged as a promising integration technique to improve microprocessor performance. In this paper we present a 3D-SIC physical ...

Dezeen School Shows: a jewellery collection informed by the patterns of growing moss is among the projects from New Designers ...

In teaching electronic, telecommunications and related engineering, the Arithmetic-Logic Unit (ALU) is a basic device for understanding digital electronics and binary and combinational logic. This ...

Double-network (DN) hydrogels, with their unique combination of mechanical strength and toughness, have emerged as promising materials for soft robotics and tissue engineering. In the past decade, ...