Reviewing the shortcomings of the conventional 2D layout power module, work appearing in CES Transactions on Electrical Machines and Systems proposed a packaging method that multiple DBC-staked units ...

More information: Puqi Ning et al, Review of Thermal Design of SiC Power Module for Motor Drive in Electrical Vehicle Application, CES Transactions on Electrical Machines and Systems (2024). DOI ...

This paper reviews the thermal design of SiC power modules for EV motor drives, focusing on optimizing irregular Pinfin structures to enhance heat dissipation. It proposes a collaborative thermal ...

Wolfspeed is bringing the power-handling properties of silicon carbide (SiC) to the renewable energy, energy storage, and high-capacity EV fast-charging sectors with its new family of 2,300-V ...

As design engineers transition to SiC power solutions, Microchip Technology has announced the MPLAB – a SiC Power Simulator. With electrification driving the growth of SiC semiconductors designers ...

These modules demand the highest power loads and are rated at 1000s of voltages – and the design of power devices, which are the fundamental electronic component of the power modules, is crucial, as a ...

ROHM Co., Ltd. has developed new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package for power-factor-correction (PFC) circuits and LLC-resonant converters (LLC) used in the onboard ...

The Cissoid CMT-PLA3SB12340A SiC mosfet intelligent module is available from the distributor with reference designs for customisation.. Applications include power systems for electric cars, buses, ...

The proposed 1200V/1500A all-SiC full-bridge power module based on the proposed DBC-stacked packaging unit. ... Reviewing the shortcomings of the conventional 2D layout power module, ...

Compact high heat dissipation design sets a new standard for OBCs ROHM's new 4-in-1 and 6-in-1 SiC Molded Modules in the HSDIP20 Package Optimized for PFC and LLC converters in onboard chargers ...

ROHM Develops New High-power-density SiC Power Modules. PR Newswire. KYOTO, Japan, April 24, 2025 - Compact, High-heat-dissipation Design Sets New Standard for OBC - KYOTO, Japan, ...

Santa Clara, CA and Kyoto, Japan, April 24, 2025 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced the development of new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized ...