Kwak, Hyunsoo & Ryu, Sungyoon & Cho, Suil & Kim, Junmo & Yang, Yusin & Kim, Jungwon. (2021). Non-destructive thickness characterisation of 3D multilayer semiconductor devices using optical spectral ...

Multi-layer 3-dimensional (3D) vertical RRAM (VRRAM) PUF with in-cell stabilization scheme to improve both cost efficiency and reliability. The proposed PUF features excellent resistance against ...

On the one hand, machine learning and artificial intelligence have already revolutionized our lives from everyday tasks to scientific research. On the other hand, quantum computing has emerged as ...