As some of the newer dc-dc point-of-load (POL) converters are packaged into smaller and smaller surface-mount packages, thermal and electrical layout Dara Crowe, Product Manager, Power-One ...

The CSD18541F5 expands TI's NexFET™ technology portfolio of FemtoFET MOSFETs to include higher voltages and manufacturing-friendly footprints. Download the design summary with more information on the ...

“System-in-Package is a functional system or subsystem assembled into a standard footprint package such as LGA, FBGA, QFN, or FO-WLP. It contains two or more dissimilar die, typically combined ...

The Land-Grid-Array (LGA) form factor with a footprint of only 795mm 2 is especially suitable for compact devices, e.g. e-readers or PDAs, with data-rich applications like multimedia. ... The LGA ...

The LGA package is a laminate substrate-based, fine-pitch chip-scale package that provides a low package profile. The package body dimensions are identical to the CCGA packages currently available.

This is a 45% footprint and 21% thickness reduction compared to the previous 1.6mmx1.6mmx0.94mm mCube MC3635 LGA package and a 64% footprint reduction compared to the present 2mmx2mm LGA package.