News

announced that they have successfully created contact hole patterns for a wide variety of practical logic and memory devices using a next-generation directed self-assembly (DSA) process.
Will directed self-assembly (DSA) join Extreme Ultraviolet ... Another critical issue cited by the crowd was pattern roughness. DSA is known to suffer from higher levels of line-edge/line-width ...
Ten years ago, when the industry was struggling to deliver EUV lithography, directed ... pattern that we can guide the self-assembly of a local polymer that will do the work to make a clean pattern.” ...
A new paper claims that directed self-assembly could be key to ... The original lithographic pattern forms the guide for the copolymer line position. But the chemical process results in lines ...
ACS Nano – Simple and Versatile Methods To Integrate Directed Self-Assembly with Optical Lithography Using ... and straight forward DSA platform to generate sub-lithographic line-space patterns and ...
Figure 1: Conventional and selective directed self-assembly. Figure 2: DSA of lamella and cylinders on chemical line grating patterns. Figure 4: Predictions of an energy model for ordering of a ...
By simply adjusting the spacing and thickness of the lithographic line patterns-easy to fabricate ... Stein et al, Selective directed self-assembly of coexisting morphologies using block copolymer ...
A new interface control technique for block co-polymer self-assembly could provide long-sought method for making even tinier patterns on microchips ... up an image line by line, by scanning ...
Known as directed ... line able to use self-assembly in its pilot fab in 2012. Work there has focused on reducing errors in self-assembled structures through improved materials and better pre ...
However, flow instabilities within the evaporating droplet often result in non-equilibrium and irregular dissipative structures, e.g., randomly organized convection patterns ... followed by subsequent ...
Stanford researchers sponsored by SRC have successfully created contact hole patterns for a wide variety of practical logic and memory devices using a next-generation directed self-assembly process.