CMP modeling allows design and manufacturing teams to find and fix potential planarization issues before the actual CMP process is applied to a wafer. Currently, CMP modeling is widely used for ...

First order process modeling can help tremendously with process setup and integration challenges that occur in a semiconductor fabrication flow, ... This additional input to the model is demonstrated ...

6. The SOD process erosion and dishing fitting during training shows good fitting of measured data. The validation of the model was done on a different CMP test chip with SOD compact model ...

Model-based metal fill uses thickness variation and CMP hotspot reduction as the primary drivers of the metal filling process. Model-based metal fill takes into account the simulation results and the ...

This article explores three types of process data analytics useful in ensuring high CMP yields: electrochemical analysis during blending, in-line process chemistry monitoring and particle size ...

It comes with test-chip-calibrated models for some supported processes already, and has the ability to plug into either foundry CMP models or—uniquely, according to Mentor—user-owned and maintained ...

The most commonly used chemical oxidizer for the CMP process is hydrogen peroxide, and as such, the majority of semiconductor CMP slurries have it added in. However, they assure in spec slurry purity ...