Advanced Micro Devices AMD and Broadcom AVGO are key providers of semiconductor chips that power artificial intelligence (AI) ...

uses the company’s CDNA 3 architecture that is expressly designed for data center applications. In an extended road map, AMD said it will release the MI325X later this year. It will then release ...

with the same CDNA 3 architecture, but just enough oomph to make it a viable alternative to the H200, Nvidia’s AI powerhouse. Eagle-eyed readers will also notice that AMD has cut the onboard ...

uses the company's CDNA 3 architecture that is expressly designed for datacentre applications. In an extended road map, AMD said it will release the MI325X later this year. It will then release in ...

Here’s how it works. The MI355X, now expected to arrive by mid-2025, is manufactured on TSMC’s 3nm node and built on AMD's new CDNA 4 architecture. It will feature 288GB of HBM3E memory ...

Based on AMD’s next-generation CDNA 4 architecture and using a 3-nanometer manufacturing process, the MI350 series will include the MI355X GPU, which will feature 288GB of HBM3e memory and 8 TB ...

AMD’s MI325X is currently under production. Its next-generation MI350 series, based on CDNA 4 architecture, promises a 35 times increase in AI compute performance compared with CDNA 3.