The process further allows thinning down the wafers to 50µm with a total thickness variation of less than 2µm. In the new 3D integration flow, a TSV contact is buried in the wafer during front-side ...

integrated Cadence ® 3D-IC advanced packaging integration flow has achieved certification for the Samsung Foundry MDI ™ (Multi-Die-Integration) packaging flow based on the 7nm Low Power Process (7LPP) ...