With Xpedition Substrate Integrator (xSI), Xpedition Package Designer (xPD), and Calibre3DSTACK, Siemens already offers many of the required tools to help you master FOWLP and 2.5D design. Still, in ...

There’s going to be a lot of design rules they have to adhere to in a 2.5D flow. That will limit the danger of doing something wrong compared to the past, but they’re still going to need to look at ...

The GLOBALFOUNDRIES 2.5D technology addresses the challenges of multi-die integration with solutions for front-end steps such as via-middle TSV creation, and flexibility for the backend steps ...

The choice between 2.5D and 3D design approaches depends largely on the specific application requirements, including size, performance, and integration complexity. The 3DIC Compiler from Synopsys ...

This article examines the terminology associated with 3D-ICs and reviews what 2.5D is, what 3D is, and what the tradeoffs are. It then introduces some 3D-IC design challenges such as system ...

Now available for High-Performance Computing and AI ASIC Designs Alchip’s 2nm test chip Alchip’s 2nm test chip targets a gate ...

Today, the most advanced AI chips can cram up to 2,500 mm 2 of silicon and up to eight HBM when assembled with 2.5D packaging. That’s approximately 3X the amount of silicon in NVIDIA’s current ...

New World Team Talks 2.5d Cinematics, Creating Them, and Fleshing Out Lore and Stories Christina Gonzalez Updated: Aug 8, 2023 6:10 PM Posted: Aug 8, 2023 6:10 PM ET Category: News 0 ...

The 2.5D system-in-package will use a 3nm chiplet or chiplets coupled with HBM memory. "We are pleased to announce our 3nm design collaboration with AD Technology," said Jung Ki-Bong, ...